Precision Dispensing in Semiconductor Packaging
Precision Dispensing for Repeatable Processes in Semiconductor and Advanced IC Packaging
In semiconductor packaging, increasingly smaller and more powerful components must be reliably interconnected, protected, and thermally managed. As integration density increases and new concepts emerge in advanced semiconductor packaging, the requirements for process stability, yield, and repeatability are also becoming more demanding. Precise and controllable dispensing is therefore critical for many of these process steps.
From smartphones and data centers to vehicles, aerospace, and industrial applications, the quality of the packaging process directly affects the reliability and service life of electronic components. Particularly with high packaging densities and sensitive component geometries, dispensing materials must be applied with precision and repeatability.
Precision dispensing and microdispensing in semiconductor packaging determine more than just how accurately a material is placed. Equally important are repeatable dispense volumes, controlled material flow, and stable process control.
Precision Dispensing Technology for Demanding Packaging Processes
The precision dispensing systems from marco support semiconductor manufacturers – including Integrated Device Manufacturers (IDMs) – as well as Outsourced Semiconductor Assembly and Test providers (OSATs) and equipment manufacturers in developing and implementing demanding dispensing processes.
In addition to dispensing accuracy, the focus is also on process control. Process data and feedback from the dispensing system make it possible to monitor the application, detect process deviations at an early stage, and support stable production conditions.
Dispensing Solutions for Semiconductor and IC Packaging
Depending on the semiconductor or IC packaging process, different materials and dispensing tasks are required. marco develops dispensing components, systems, and customized process solutions for applications including:
Technical Highlights at a Glance
| Underfill Dispensing | Precise dispensing of underfill material to mechanically stabilize chip interconnections and protect them against thermal and mechanical stress. |
| Thermal Interface Material (TIM) Dispensing | Defined application of Thermal Interface Materials (TIMs) for reliable thermal coupling and efficient heat transfer. |
| Solder Paste Dispensing with StepDot | Precise and repeatable solder paste deposits for demanding interconnection processes in semiconductor packaging. |
| Flux Dispensing | Controlled application of flux for soldering and interconnection processes. |
| Protective Coating and Encapsulation | Precise material application to protect sensitive electronic structures from mechanical stress and environmental influences. |
Dispensing Process, Material, and Equipment as an Integrated System
marco develops and supplies precision dispensing systems and process solutions for semiconductor packaging—all from a single source—ranging from bubble-free material delivery to dispensing valves, dispensing heads, and dispensing robots, all the way to process control and system integration. This ensures that the individual components are not only technically coordinated with one another but are also considered as part of an integrated system right from the design phase.
This is not just a matter of selecting a suitable metering valve. To ensure a stable and reproducible metering process, the material supply, dispensing technology, motion system, process control, and system integration must all be coordinated.
Material properties, dispense volume, component geometry, process speed, and process feedback are incorporated into the system design, along with requirements relating to cycle time, automation, and interfaces with the overall production equipment.
True to its name, marco System Analysis and Development therefore supports customers both in developing and optimizing dispensing processes and in implementing complete dispensing systems tailored to the specific application. Depending on customer requirements, individual components can be integrated, or complete solutions can be developed for both existing and newly designed production equipment.
The result is repeatable dispensing processes for semiconductor packaging and advanced IC packaging – from material supply and precise application to integration into automated production.
Your Dispensing Application in Semiconductor Packaging
Are you developing a new dispensing process, looking to optimize an existing application, or searching for the right solution to integrate into your production equipment?
Our application experts support you from process analysis through to the selection of the right dispensing technology.